Program on Semiconductor Packaging and Testing [PSPT]
Aug, FebStarting Month
Programme overview
Main Subject
Engineering - Electrical and Electronic
Degree
Other
Study Level
Masters
Study Mode
On Campus
Semiconductor packaging and testing is the key to manufacturing a fully functionalized and durable electronic device. Our program integrates the relevant courses offered at National Cheng Kung University, Taiwan and cooperates with the industry to achieve the goal of cultivating semiconductor packaging and testing professionals. The curriculum covers the three major areas: packaging processes, packaging and testing smart manufacturing, and packaging and testing materials. Industrial professionals are also hired to offer practical courses so that students have both academic foundations and practical experience. In terms of thesis research, it is implemented based on the concept of industry proposition and academic problem-solving. Graduates from this program are expected to have a higher priority in recruitment in related industries after graduation.
Programme overview
Main Subject
Engineering - Electrical and Electronic
Degree
Other
Study Level
Masters
Study Mode
On Campus
Semiconductor packaging and testing is the key to manufacturing a fully functionalized and durable electronic device. Our program integrates the relevant courses offered at National Cheng Kung University, Taiwan and cooperates with the industry to achieve the goal of cultivating semiconductor packaging and testing professionals. The curriculum covers the three major areas: packaging processes, packaging and testing smart manufacturing, and packaging and testing materials. Industrial professionals are also hired to offer practical courses so that students have both academic foundations and practical experience. In terms of thesis research, it is implemented based on the concept of industry proposition and academic problem-solving. Graduates from this program are expected to have a higher priority in recruitment in related industries after graduation.
Admission Requirements
1. Domestic university graduates (including fresh graduates).
2. Overseas university graduates (including fresh graduates).
3. Accept those with the same academic ability.
Prepare materials according to the current year's prospectus
The following are for reference:
1. Personal review information (please download the admission announcement on the website of each degree program)
2. University (college) transcripts over the years
3. Two letters of recommendation
4. Research proposal book
5. Autobiography
6. Other supporting documents or special reports that are helpful for the review (the special work is a multi-person collaborator, the name of the collaborator and the part he is responsible for must be specified in detail, and the instructor or department supervisor should sign. , not admitted)
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